Chundong Zhao¹, Xiaoyan Chen¹, Dongyang Zhang¹, Jianyong Chen¹, Kuifeng Zhu², Yanjie Su^2
1College of Electronic Information and Automation, Tianjin University of Science and Technology, Tianjin, China
²Tianjin Fly Tech Co., Ltd, Tianjin, China
pp. 91-95
ABSTRACT
With the development of integrated electronic circuit manufacturing technology, enterprises have put forward higher requirements for the quality of silicon chips. Aiming at the low efficiency of silicon wafer defect detection, this paper proposes an automatic defect detection method based on machine vision. The voiding algorithm based on flood fill can effectively extract the inner contour information of the wafer profile. A rotation correction algorithm is proposed to correct the wafer yaw angle. The actual wafer was used to verify the performance of the proposed method. The results show that the proposed method is effective in detection accuracy.

ARTICLE INFO
Article History
Received 10 November 2019
Accepted 17 July 2020

Keywords
Machine vision
Flood fill
Defect detection
Rotation correction

JAALR1208

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